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Tensilica Announces New High-Performance ConnX DSP Family for LTE and 4G SOC Designs
SANTA CLARA, Calif. – June 22, 2009 – Tensilica, Inc. today introduced a new family of high-performance DSPs (digital signal processors) IP (intellectual property) cores – the ConnX DSP family – that include standard cores, click-box configurable options or a starting point for customized Xtensa LX DPUs (dataplane processor units) for SOC (system-on-chip) [...]
IMEC unveils tools to speed up design of energy-efficient multi-processor SoC platforms
IMEC announced The IMEC MPSoC technology provides solutions by focusing on design-time application mapping. The technology’s two main threads offer support for fast parallelization (with the Multi-processor Parallelization Assistant tool) and support for memory hierarchy optimizations (with the Memory Hierarchy tool).
IMEC’s tools, methods, and associated services have a proven industrial strength. They have been used [...]