BERLIN, May 18 /PRNewswire-FirstCall/ – CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores and Aricent™, a global innovation, technology and services company focused exclusively on communications, announced today that the companies will demonstrate a licensable IP platform for LTE baseband terminals based on a CEVA DSP core at the LTE World Summit 2009, May 18-20 in Berlin, Germany. The platform will showcase a CEVA DSP running several LTE physical layer functions purely in software. The demonstration will be on display at Aricent’s expo booth #10 in the main exhibition hall.
Aricent’s modular implementation of the LTE Category 3 UE PHY provides building blocks that offer the flexibility to implement an LTE PHY using the most appropriate architecture for the target silicon. The modular format also allows replacing key processing modules (FFT, DFT, FEC, etc) with accelerators enabling power savings, while fully leveraging the processor architecture. Customers can select and optimize low-level functional modules or choose complete chains PUSCH or PRACH. The Aricent LTE PHY also offers configuration flexibility between the different channel bandwidth ranging from 1.4 to 20 MHz.
